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Friday, March 7, 2014

"The Company Believes Shipments to resume shortly"

 "Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one PCB to another."

It's clear from eMagin previous announcement that there was some question in eMagin's mind that the concerns of Raytheon and the others and their "exacting standards" were warranted but the customer is always right, if it was one company I could understand their position but three? Smoke=Fire. The 8-K references "a microdisplay", could "exacting standards" indicate that the OEMs will not tolerate one failure out of the box? Meaning they are not interested in re-testing the component before it's integrated into the TWS or whatever and the applications are so critical they cannot live with the possibility of a system failure in a combat zone. All of the above I think.


http://ir.emagin.com/phoenix.zhtml?c=96135&p=irol-SECText&TEXT=aHR0cDovL2FwaS50ZW5rd2l6YXJkLmNvbS9maWxpbmcueG1sP2lwYWdlPTk0NTAzNTYmRFNFUT0wJlNFUT0wJlNRREVTQz1TRUNUSU9OX0VOVElSRSZzdWJzaWQ9NTc%3d

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